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Specifications: Model 4500E Series, Motorized
Step-Back Wire Bonders Last revised: 4/18/2003
Prologue
West¡¤Bond¡¯s new "E" Version starts the
twentieth year of the Model 4500 tradition. This machine was revolutionary at
its inception as the first to make a wire bond connection fully under
programmable software control executed digitally by motors, thus making
possible the manufacture of high frequency, high power semiconductor devices
where connections must be identical. The original design, with digiswitches for
input and with LED¡¯s to display individual data lines by binary value, remained
unchanged by customer insistence until finally supplanted by the current 4500
Model of the "B" Series. Now, Model 4~00E brings forward the new
advances of the "E" Series, notably the placement of all machine
mechanism above the work plane to allow unlimited access, and the setting of
axis brakes to lock on target. In this model the tool, rather than the work, is
moved, both for alignment and for bonding, with the work pre-rotated. There is
choice of alignment by either microscope or video. Bond heads are built around
a 63 kHz ultrasonic transducer and provide full three-way convertibility.
Application
Machines of this series bond aluminum or gold wires
from 0.0007 in. to 0.002 in. diameter, primarily to stitch bond a succession of
parallel multi-arch wires, but useful for bonding any program of shaped
connections. Three bond methods are available by tool head conversion;
angled-feed wedge bonding, vertical-feed wedge bonding, and Negative EFO ball
bonding. Both wedge bond methods require front-to-back wire progress, hence
pre-rotation of the work piece. Wherever possible, angled feed wedge bonding is
recommended because clamps very near the bond foot can have the best effect to
work the wire into arches. Ball bond connections can be similarly shaped, even
by complex motions, if rotation is pre-set. This machine is also uniquely
capable of making a succession of spaced single-ball bonds. Further, a machine
of this series can be assembled without feed mechanism to Tab Bond a pattern of
connections, such as on the flex circuits of computer disk read heads.
Mechanical
Bonding mechanism is constructed of four axes,
straight-line and orthogonal, stacked in an array. Two axes, X and Y, are
driven by micromanipulator for positioning, then held by pneumatic brakes for
bonding. Two axes, W (in Y direction) and Z, are driven by programmed motors to
create and arch the connection. The vertical view video camera is mounted atop
the X-Y axes so that the manipulator moves its target crosshairs. When video
method is chosen, the tool is withdrawn along the W axis during alignment. When
aligning by microscope, target is judged by an angled view of the tool at a
search elevation just above the work. Approach to search and then down to
contact can be controlled by a separate manual encoder that generates clocks to
drive the Z Motor directly, or can be controlled at the keypad or by a
push-button on the right-hand control. These different methods can be used
interchangeably in any sequence. Similarly, alignment by microscope or video is
optional. Video alignment allows bonding of the entire connection after a
single input accepting the targeting of the critical bond, though requiring
extra runs on the W axis to hide the tool. Microscope alignment allows direct
view of and placement of all bonds with minimum movements. The work piece is
aligned front-to-back on a large fixed platform. Optional rotating and
adjustable height platforms are available. Alignment can be checked before
bonding by scanning methods.
Ranges, Ratios and Resolutions
X-Y Positioning, by Manipulator
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0.625" Total, +/- 0.3125" @ 8/1
Ratio |
Y Stroke (W axis), by Motor
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0.500" Total, 0.200" Forward, 0.300"
Rearward |
Resolution
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0.00333" per half-step, 0.000208" per micro-step |
| Z Stroke, by Motor |
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0.500" Total, 0.460" Up, 0.040" Down |
Resolution
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0.00333" per half-step, 0.000208" per micro-step |
Z Encoder, Manual
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0.125" Touchdown from Search @ 8/1 Ratio |
Resolution
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0.001" per encoder transition |
| Work Platform, by Thumbscrew |
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0.625" Total, 0.500" Up, 0.125" Down
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Bond Tool Head Assemblies
The new forward-pivot tool assemblies of this series
are built around K~Sine Transducer, Model No. K~24-EW, operated at 63 KHz. It
is driven by K~Sine Part No. 6795 Ultrasonic Power Supply, four Watts, dual
channel, with power and time set as program values. This transducer uses a bond
tool of 0.750" length dropped 0.65625" below center. Vertical
clearance is a full 0.375" everywhere under these tool heads and all other
mechanism except for wire presentation at 45¡Æ for angled feed. Wire Clamps are
air-opened and spring-closed, and have self-contained closure pivots. A
separate pivot about an axis located to serve both overhead and angled feed
generates the clamp motions along their lines of feed action. To change between
angled feed and overhead feed, it is necessary only to exchange the small clamp
assemblies and to change the wire drag means. Alignment of clamps to the tool
is facilitated by individual adjustments along three axes. Actuation of all
clamp motion is by the same spiral cam of an inboard motor and is transferred
through the pivots of the four-bar linkage. Appropriate clamp motion settings
for each method are configured in software and are retained in non-volatile
memory. Motions toward the tool are spring-driven, while the more powerful
motor drives away from the tool ? to ease concerns during set-up.
Rigid bearing mounts, rather than taper loading, fix
the strut bar of this assembly so that any required bond force can be applied.
The standard set of force springs generates 15 to 250 grams, and together with
the work-sensing firing switch, is built into the four-bar linkage. A dual
force mechanism, operated pneumatically, acts to change between two pre-set
force values, and either high or low force may be programmed for any bond.
Radiant tool heat with panel mounted, constant current control is included.
Machine Configuration
The mechanism of this series was designed to mount
above a customer's work handling system, to be confined entirely above the work
plane, and so not to have any base or work platform. In this configuration, a
model of this series is designated as "4~~~EX". For use as a
stand-alone complete bonding machine, the mechanism will be completed with a
plain base having a bolted-on, adjustable height, rotating, work platform, and
will be designated as "4~~~E". In either the "E" or the
"EX" configurations, optional control arms are included to move both
the manipulator control point and the Z axis encoder control point five inches
vertically from their normal positions near the machine base to new locations
above the work plane. When the high control arrangement is used, the customer
must provide suitable operator's forearm rests. This is essential both for the
operator's safety and comfort, and to provide a stable platform from which to
direct control motions with the accuracy required for wire bonding. The manual
Z Encoder method of controlling tool descent is optional.
Mounting points for the "EX" version of
this mechanism are provided at two foot locations at the work plane elevation
5.000 in. above table surface, approximately 22.312 in. apart, and 8.734 in. to
the rear left, and 13.093 in. rear right, of the work point.
Electrical Software and Hardware
A software
program controls operation of motors and other actuators, as configured by
setup values, in response to operator¡¯s inputs. It accepts entry of data about
User¡¯s Devices to create different Types of connections. These Types may have
any number of Bonds, up to 100, and may be repeated for any number of Wires up
to the maximum of 6000 individual Bonds. Data to define all the motions
required to create the connections are stored in Buffers that are selected by
the keypad. Default values are 30 Types of 5 Bonds per Type which yields 40
Device Buffers. West¡¤Bond Part No 8100 CPU, containing a Motorola 68000
microprocessor and 256 KB of nonvolatile RAM executes the software program.
A keypad is provided for direct entry and editing of
both configuration and user data and for selection of operation options. Entry
and execution is prompted at the machine panel by a series of
"screens" displayed on a 4-line 40-character LCD. All programmed
values are displayed during bonding. At "home", various options are
enabled including a patented self-threading routine for the angled feed method.
Operating Controls.
- Keypad.
Twelve-key pad for entry of program data, setting of Modes, and direct
control of machine actions. At left hand.
- Z Encoder. Generates
Z-Axis motor step clocks: A home sensor parallels the G Key and the Ball
Button. At left hand with both high and low control arms.
- X-Y Manipulator. Moves tool
head, TV camera, and motorized slides atop X-Y-Axes with 8/1 mechanical
advantage. At right hand with both high and low control arms.
- Ball Button.
Push-button switch in the manipulator control ball. Parallels the G Key
but also acts to lock only the X-Axis for scanning the bond path along the
Y-Axis, front-to-back.
- Rotary Work Table. Rotates
about the center of tool motion range to pre-set the alignment of bonds
front-to-back.
Modes of Operation.
- Monitor or Microscope. When
toggled by Key 9, the bond tool moves along the W-Axis between the target
position above this bond, and a retracted position out of camera view.
- Monitor -- Target the
beginning bond of the sequence on the television monitor screen. Move the
camera cross hairs to the bond point by the X-Y Manipulator.
- Microscope -- Target
all bonds by direct view of the tool through the microscope.
- Inhibit Auto. Modifies
only the Full-Auto Mode. It is set for each bond during Bond Edit.
- On -- Full-Auto
pauses at each search elevation for X-Y targeting while the key is held.
- Off -- Full-Auto
proceeds with no pauses.
- Full-Auto or
Half-Auto. Mode toggled by Key 8.
- Full-Auto -- Start by
G Key or Ball Button or Z Encoder. Lock manual X-Y slides and bond all
bonds of this wire. Pausing is controlled by Inhibit Auto
described above.
- Half-Auto --
Controlled by G Key or Ball Button or Z Encoder. This is a press and
release sequence with pauses at each search and loop elevation.
- Inch Mode. Start by
Zero Key. Executes Half-Auto mode except proceeds down in slow steps from
each search to contact while key is held. Available any time tool is
stopped.
ESD Protection
Protection against Electrostatic Discharge is
implemented by finishing exposed tool assemblies and other moving parts by
Electro less Nickel plating, which is conductive; and all exposed painted parts
with a powder-coated paint that is dissipative.
Definitions of Models of this
Series:
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Model No. 4546E. This machine with single wedge bond
tool head, Assy No. 9305, with angled clamp Assy No 9048 and overhead clamp
Assy No 9049, for bonding by either wedge method.
- Model No. 4546EX. This
machine, specified as Model 4546E, except without base.
- Model No. 454647E. This
machine with two bond tool heads, Assy No 9305 with the two clamp
assemblies for wedge bonding as above, and with tool head Assy No 9220 for
Negative EFO ball bonding, all convertible.
- Model No. 454647EX. This
machine specified as Model 454647E, except without base.
- Model No. 4700E. This
machine with one bond tool head, Assy No 9220 for Negative EFO ball
bonding.
Features available for "E"
Models of this Series:
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Feature No. 70. Adjustable height workstation with a rotary platform
to rotate work about the center of tool X-Y range. Assembly No. 8965.
Recommended to pre-align bonds front to back. Not for "EX models.
- Feature No. 79. Adjustable
height work platform. Assembly No. 8965. Not for "EX" models.
Accessories
The ESD protected microscope recommended for this
series is Nikon SMZ660 with the new LED illuminator "Luxuray".
Neither microscope nor illuminator is included. One recommended bonding tool is
included.
All work holders are priced separately, and should be
ordered separately. A universal unheated work holder, capable of holding most
common substrate devices between a pivoted clamp lever and adjustable
backstops, is maintained in stock and is available for delivery in the same
time span as the machine. Quite a large number of previously designed special
work holders, both heated and unheated, are available but are not stocked, and
cannot be promised for delivery with the machine. These should preferably be on
an order separate from the machine order, but if not, the machine order must
state that partial deliveries are allowed. Work holders for new work pieces
requiring custom design and fabrication will be quoted upon receipt of drawings
and samples: These must be ordered on separate purchase orders.
Services
Compressed air, regulated to 50 psig, is required.
Connection is via 1/4-inch tubing.
Electrical service required is 50-60 Hz, single
phase, either 115 VAC or 230 VAC; however, input must be configured at the
factory for 230 VAC. A fuse and three-prong power cord connector are provided
for 115 VAC: For 230 VAC, these must be changed to conform to local
requirements.
Dimensions
"E" Series machine size is 24.218"
wide x 22.297" deep x 11.000" high, exclusive of microscope, or
15.000" in height to scope eyepieces. Weight is 75 lb. uncrated, or 110
lb. crated.
"EX" Series machine size is 22.312" wide
x 16.500" deep x 6.000" high above work plane, exclusive
of microscope, or 10.0" high from work plane to scope
eyepieces. Weight is 55 lb. uncrated, or 90 lb. crated.
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