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Wyko SP3000 Interconnect
Profiling System
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This automated optical profiler provides non-contact
3D measurement of large format samples. Designed
for in-line process monitoring of flip-chip packaging,
the gauge-capable system enables users to control
critical dimensions and determine the electrical/mechanical
reliability of advanced packaging substrates. Wyko
Vision32 analysis software, included in the system,
offers specialized algorithms, an automation scripting
language, and an integrated database for automatic
data logging and real-time go/no-go feedback. A
master database allows trending analysis over a
product's lifecycle.
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Application notes for product: Wyko SP3000
Interconnect Profiling System
◆Large
Field of View, High Spatial Resolution Surface Measurements
◆Surface
Measurement Parameters |
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Wyko SP3200 Advanced Packaging Profiling
System
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For in-line monitoring of flip-chip packaging, this
gauge-capable system serves applications in both
surface metrology and defect inspection. In its
inspection role, the profiler automatically detects
solder bridges, under and oversized bumps, missing
and extra solder bumps, and bump position. For surface
metrology, the system calculates bump height, diameter,
volume, as well as three-point and regression coplanarity.
In addition, the SP3200 enables users to control
critical dimensions and determine the electrical/mechanical
reliability of advanced packaging substrates.
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Application notes for product: Wyko SP3000
Interconnect Profiling System
◆Large
Field of View, High Spatial Resolution Surface Measurements
◆Surface
Measurement Parameters |
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