Westbond

4KE (Semi-Automatic Wire Bonder)

45º Wedge – Wedge

90º Feed – Deep Access Wire

90º Feed – Deep Access Ribbon

Single Ball / Ball – Stitch / Stitch on Ball

Tab


SPECIFICATIONS

BOND AREA



ESD Protection
Conductive and dissipative


Bond Platform
11” x 11” (280 mm x 280 mm)
20” x 20” (508 mm x 508 mm) optional
Adjustable Height: 0.625" (15.9 mm)


Motorized Z Travel
0.5” (12.7 mm) / 0.000208” (5.3µm) resolution


Motorized Y Travel
0.5” (12.7 mm) / 0.000208” (5.3µm) resolution


Manual X and Y Travel
0.625”sq (17.8 mm2) @ 8:1 ratio

WIRE AND TOOL CAPABILITY



Au / Al
0.7 to 3 mil (18 to 75μm)


Ribbon
0.5 x 2mil to 1 x 10 mil (12.5 x 50μm to 25μ x 250μm)


Cu Ball Bonding
0.7 to 1.5 mil (18 to 38μm)


Spool
½” standard; 2” optional


Tool Diameter
1/16” (1.58 mm)


Shank Length
0.750” (19 mm) standard for wedge bonding
0.625” (16 mm) standard for ball bonding

ULTRASONIC SYSTEM



½ wave length, 63 KHz transducer, 110 KHz Optional



8 bit, 4 watt PLL Ultrasonic Generator



Ultrasonic tool positioning utility



Low Power: 2.5 W; High Power: 4 W


BOND PARAMETERS



Bond Force
10 – 250 grams (high/low programmable)


Bond Time
0 – 999 ms


Ball Formation
Negative EFO, Missing ball detection via Open and Short error

FACILITY REQUIREMENTS



Power Supply
100 – 120 / 220 – 240 VAC 50/60Hz (needs configuration)



50 PSI clean dry air


Dimensions
24.22” (615 mm) W x 22.29” (566 mm) D x x 11.00” (295mm) H


WeightCrated with accessories: 165lbs (75 kg)
Uncrated: 75lbs (34 kg)